Japan’s No. 1 Die Bonder Now Aiming to the World’s No.1

Part of the fabrication equipment for semiconductors, our die bonders were originally manufactured based on NEC blueprints. In 1986, we introduced an original product with the development of the CPS-100, our own proprietary epoxy die bonder offering superb versatility. Since then, our die bonders have garnered an excellent reputation and become our flagship products, and Canon Machinery Inc. now enjoy the No.1 share of the Japanese market.

In 2003, we developed the BESTEM-D01, a die bonder that makes use of our wealth of technology and that is ideal for the fabrication of small pins for LEDs and ICs. In 2004, we released the BESTEM-D02, a 300-mm wafer-compatible die bonder, and in 2005, we released the BESTEM-D03, which offers superb versatility and cost performance. With the addition of the BESTEM-D04 for the high-power market, we now have a BESTEM series with a product for the needs of all customers, from small pins for ICs and Discreet Semiconductor Derices to VLSI packages. We will continue to develop high-value-added products as we aim to be the world’s No.1 provider of die bonders.